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Diode Packaging - R&D Engineer Company Name: JAL Energy & Utilities Seeking individual with strong background in selecting solder methods and materials to bond laser diodes to a heat sink in a packaging enclosure for high-powered semiconductor lasers. Functions: Perform Finite Element Analysis (FEA), Failure Modes & Effects Analysis (FMEA) and Thermal Analysis for solder joint strength in laser diode packaging. Ensure that semiconductor diodes are aligned in the heat sink, verify that solder methods and materials allow for. After registering you may be able to apply for this job directly (if still active) on ((None))'s site. Future job matches may be sent from Geebo approved job partners.
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